The first list of exemptions covers the related substances in the 9 products:

O: Mercury and mercury in compact fluorescent lamps not exceeding 5 mg per lamp; mercury in straight fluorescent lamps for general purposes shall not exceed the phosphate - 10 mg; three normal phosphate - 5 mg; three - 8 mg of long-acting phosphate; content of mercury in straight fluorescent lamps for special purposes; mercury content in other lamps.

Cadmium: cadmium electroplating outside the directive No. 76/769/EEC of directive No. 91/338/EEC.

Six valence chromium: Six valent chromium as a preservative in carbon steel cooling system in absorption refrigerators

O lead: lead in glass of cathode ray tubes, electronic components and fluorescent tubes; lead content in alloy steel is lower than the lead content of 0.35%, Aluminum Alloy in less than 0.4%, the lead content in copper alloy is lower than 4%; lead in high melting temperature (i.e. tin lead solder alloys containing lead content more than 85%); for servers, storage and storage system of lead in solders (exemption granted until 2010); for the exchange, and signal transmission, solder and network management for telecommunications network infrastructure equipment in the lead; lead in electronic ceramic parts.

The European Commission has increased the exemption clause for RoHS in the 2005/717/EC resolution published in October 15, 2005:

The EU will be included in the "DecaBDE restrictions on the use of certain hazardous substances in electrical and Electronic Equipment Directive" (RoHS directive) exemption list.

Lead in lead bronze bearing bush and shaft bush is included in the exemption list.

The European Commission issued a new exemption clause for the RoHS directive in October 25, 2005 when the directive was issued again in 2005/747/EC:

Lead in the pin connector system;

Lead in coating materials on C rings of thermal conductivity modules;

Lead and cadmium in optical and filter glass;

Lead content (in weight) between 80% and 85%, connecting pins and lead in a package containing more than two elements in a microprocessor package.